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  d a t a sh eet product speci?cation supersedes data of 1996 dec 18 file under integrated circuits, ic03 1998 may 11 integrated circuits PCD3349A 8-bit microcontroller with dtmf generator
1998 may 11 2 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A contents 1 features 2 general description 3 ordering information 4 block diagram 5 pinning information 5.1 pinning 5.2 pin description 6 frequency generator 6.1 frequency generator derivative registers 6.2 frequency registers 6.3 dtmf frequencies 6.4 modem frequencies 6.5 musical scale frequencies 7 timing 8 reset 9 stop mode 10 idle mode 11 instruction set 12 summary of mask options 13 limiting values 14 handling 15 dc characteristics 16 ac characteristics 17 package outlines 18 soldering 18.1 introduction 18.2 dip 18.3 so 19 definitions 20 life support applications
1998 may 11 3 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 1 features 8-bit cpu, rom, ram, i/o in a single 28-lead package 4-kbyte rom 224-byte ram over 100 instructions (based on mab8048) all of 1 or 2 cycles 20 quasi-bidirectional i/o port lines 8-bit programmable timer/event counter 1 2 single-level vectored interrupts: C external C timer/event counter 1 two test inputs, one of which also serves as the external interrupt input dtmf tone generator reference for supply and temperature-independent tone output filtering for low output distortion (cept compatible) power-on-reset stop and idle modes supply voltage: 1.8 to 6 v (dtmf tone output from 2.5 v) low standby voltage of 1 v low stop mode current of 1 m a (typical) clock frequency: 1 to 16 mhz (3.58 mhz for dtmf suggested) manufactured in silicon gate cmos process. 2 general description the PCD3349A provides 4 kbytes of program memory, 224 bytes of ram and 20 i/o lines. the PCD3349A is a microcontroller which has been designed primarily for telecom applications. it includes an on-chip dual tone multi-frequency (dtmf) generator. the instruction set is based on that of the mab8048 and is software compatible with the pcd33xxa family. this data sheet details the specific properties of the PCD3349A. the shared characteristics of the pcd33xxa family of microcontrollers are described in the pcd33 xx a family data sheet and also in data handbook ic03; section pcd33 xx a family , which should be read in conjunction with this publication. 3 ordering information type number package name description version PCD3349Ap dip28 plastic dual in-line package; 28 leads (600 mil) sot117-1 PCD3349At so28 plastic small outline package; 28 leads; body width 7.5 mm sot136-1
philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 1998 may 11 4 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here in this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force land scape pages to be ... 4 block diagram handbook, full pagewidth oscillator mbg098 port 0 flip-flop port 0 buffer 88 higher program counter lower program counter program status word memory bank flip-flops resident rom 4 kbytes decode 8 t1 8 8 5 888 8 8 p0.0 to p0.7 ram address register accumulator temporary register 1 PCD3349A hgf register 8 88 lgf register sine wave generator temporary register 2 arithmetic logic unit instruction register & decoder decimal adjust control & timing xtal 2 xtal 1 reset stop idle interrupt initialize conditional branch logic ce / t0 ce / t0 t1 timer flag carry acc acc bit test resident ram array 224 bytes multiplexer 8 level stack (variable length) optional second register bank data store d e c o d e register 0 register 1 register 2 register 3 register 4 register 5 register 6 register 7 port 1 flip-flop port 1 buffer p1.0 to p1.7 8 8 port 2 flip-flop port 2 buffer p2.0 to p2.3 4 4 timer/ event counter 32 internal clock frequency 30 8 88 8 8 interrupt logic timer interrupt external interrupt tone filter power-on-reset v por reset fig.1 block diagram.
1998 may 11 5 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 5 pinning information 5.1 pinning fig.2 pin configuration (sot117-1 and sot136-1). handbook, halfpage PCD3349A mbg087 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 p0.1 p0.0 p2.3 p2.2 p2.1 v dd tone v ss p2.0 p1.7 p1.6 p1.5 p1.4 p1.3 p1.2 p0.2 p0.3 p0.4 p0.5 p0.6 p0.7 t1 xtal1 xtal2 reset p1.0 p1.1 ce/t0 5.2 pin description table 1 sot117-1 and sot136-1 packages symbol pin description p0.0 to p0.7 28, 1 to 7 port 0: 8 quasi-bidirectional i/o lines t1 8 test 1 or count input of 8-bit timer/event counter 1 xtal1 9 crystal oscillator or external clock input xtal2 10 crystal oscillator output reset 11 reset input ce/ t0 12 chip enable or test 0 p1.0 to p1.7 13 to 20 port 1: 8 quasi-bidirectional i/o lines p2.0 to p2.3 21, 25, 26, 27 port 2: 4 quasi-bidirectional i/o lines v ss 22 ground tone 23 dtmf output v dd 24 positive supply voltage
1998 may 11 6 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 6 frequency generator a versatile frequency generator section is provided (see fig.3). for normal operation, use a 3.58 mhz quartz crystal or pxe resonator. the frequency generator includes precision circuitry for dual tone multifrequency (dtmf) signals, which is typically used for tone dialling telephone sets. the tone output can alternatively issue twelve modem frequencies for data rates between 300 and 1200 bits/s. in addition to dtmf and modem frequencies, two octaves of musical scale in steps of semitones are available. 6.1 frequency generator derivative registers table 2 gives the derivative addresses, mnemonics and access types of the frequency generator derivative registers. the addresses 03h to ffh are not used. table 2 addresses of the frequency generator derivative registers notes 1. hgf = high group frequency; access type w. 2. lgf = low group frequency; access type w. address register 7 6 5 4 3 2 1 0 01h hgf (1) h7 h6 h5 h4 h3 h2 h1 h0 02h lgf (2) l7 l6 l5 l4 l3 l2 l1 l0 fig.3 block diagram of the frequency generator section. d book, full pagewidth hgf register mbg099 digital sine wave synthesizer 8 switched- capacitor bandgap voltage reference dac dac lgf register digital sine wave synthesizer 8 8 internal bus switched- capacitor low-pass filter rc low-pass filter tone
1998 may 11 7 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 6.2 frequency registers the two frequency registers hgf and lgf define two frequencies. from these, the digital sine synthesizers together with the digital-to-analog converters (dacs) construct two sine waves. their amplitudes are precisely scaled according to the bandgap voltage reference. this ensures tone output levels independent of supply voltage and temperature. the amplitude of the low group frequency sine wave is attenuated by 2 db compared to the amplitude of the high group frequency sine wave. the two sine waves are summed and then filtered by an on-chip switched capacitor and rc low-pass filters. these guarantee that all dtmf tones generated fulfil the cept recommendations with respect to amplitude, frequency deviation, total harmonic distortion and suppression of unwanted frequency components. the value 00h in a frequency register stops the corresponding digital sine synthesizer. if both frequency registers contain 00h, the whole frequency generator is shut off, resulting in lower power consumption. the frequency of the sine wave generated is dependent upon the decimal value x held in the frequency registers (hgf and lgf), and this may be calculated as follows: ; where 60 x 255. the frequency limitation given by x 3 60 is due to the low-pass filters which would attenuate higher frequency sine waves. 6.3 dtmf frequencies assuming an oscillator frequency f xtal = 3.58 mhz, the dtmf standard frequencies can be implemented as shown in table 3. the relationship between telephone keyboard symbols and the frequency register contents are given in table 4. f f xtal 23 x 2 + () [] -------------------------------- - = table 3 dtmf standard frequencies and their implementation; value = lgf, hgf contents table 4 dialling symbols, corresponding dtmf frequency pairs and frequency registers content value (hex) frequency (hz) deviation standard generated (%) (hz) dd 697 697.90 0.13 0.90 c8 770 770.46 0.06 0.46 b5 852 850.45 - 0.18 - 1.55 a3 941 943.23 0.24 2.23 7f 1209 1206.45 - 0.21 - 2.55 72 1336 1341.66 0.42 5.66 67 1477 1482.21 0.35 5.21 5d 1633 1638.24 0.32 5.24 telephone keyboard symbols dtmf freq. pairs (hz) lgf value (hex) hgf value (hex) 0 (941, 1336) a3 72 1 (697, 1209) dd 7f 2 (697, 1336) dd 72 3 (697, 1477) dd 67 4 (770, 1209) c8 7f 5 (770, 1336) c8 72 6 (770, 1477) c8 67 7 (852, 1209) b5 7f 8 (852, 1336) b5 72 9 (852, 1477) b5 67 a (697, 1633) dd 5d b (770, 1633) c8 5d c (852, 1633) b5 5d d (941, 1633) a3 5d (941, 1209) a3 7f # (941, 1477) a3 67
1998 may 11 8 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 6.4 modem frequencies again assuming an oscillator frequency f xtal = 3.58 mhz, the standard modem frequency pairs summarized in table 5 can be implemented. it is suggested to define the frequency by the hgf register while the lgf register contains 00h, disabling low group frequency generation. table 5 standard modem frequency pairs and their implementation notes 1. standard is v.21. 2. standard is bell 103. 3. standard is bell 202. 4. standard is v.23. 6.5 musical scale frequencies finally, two octaves of musical scale in steps of semitones can be realized, again assuming an oscillator frequency f xtal = 3.58 mhz (table 6). it is suggested to define the frequency by the hgf register while the lgf contains 00h, disabling low group frequency generation. hgf valu e (hex) frequency (hz) deviation modem generated (%) (hz) 9d 980 (1) 978.82 - 0.12 - 1.18 82 1180 (1) 1179.03 - 0.08 - 0.97 8f 1070 (2) 1073.33 0.31 3.33 79 1270 (2) 1265.30 - 0.37 - 4.70 80 1200 (3) 1197.17 - 0.24 - 2.83 45 2200 (3) 2192.01 - 0.36 - 7.99 76 1300 (4) 1296.94 - 0.24 - 3.06 48 2100 (4) 2103.14 0.15 3.14 5c 1650 (1) 1655.66 0.34 5.66 52 1850 (1) 1852.77 0.15 2.77 4b 2025 (2) 2021.20 - 0.19 - 3.80 44 2225 (2) 2223.32 - 0.08 - 1.68 table 6 musical scale frequencies and their implementation note 1. standard scale based on a4 at 440 hz. note hgf value (hex) frequency (hz) standard (1) generated d#5 f8 622.3 622.5 e5 ea 659.3 659.5 f5 dd 698.5 697.9 f#5 d0 740.0 741.1 g5 c5 784.0 782.1 g#5 b9 830.6 832.3 a5 af 880.0 879.3 a#5 a5 923.3 931.9 b5 9c 987.8 985.0 c6 93 1046.5 1044.5 c#6 8a 1108.7 1111.7 d6 82 1174.7 1179.0 d#6 7b 1244.5 1245.1 e6 74 1318.5 1318.9 f6 6d 1396.9 1402.1 f#6 67 1480.0 1482.2 g6 61 1568.0 1572.0 g#6 5c 1661.2 1655.7 a6 56 1760.0 1768.5 a#6 51 1864.7 1875.1 b6 4d 1975.5 1970.0 c7 48 2093.0 2103.3 c#7 44 2217.5 2223.3 d7 40 2349.3 2358.1 d#7 3d 2489.0 2470.4
1998 may 11 9 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 7 timing although the PCD3349A operates over a clock frequency range from 1 to 16 mhz, f xtal = 3.58 mhz will usually be chosen to take full advantage of the frequency generator section. 8 reset in addition to the conditions given in the pcd33xxa family data sheet, all derivative registers are cleared in the reset state. 9 stop mode since the oscillator is switched off, the frequency generator receives no clock. it is suggested to clear both the hgf and lgf registers before entering stop mode. this will cut-off the biasing of the internal amplifiers, considerably reducing current requirements. 10 idle mode in the idle mode, the frequency generator remains operative. 11 instruction set restrictions since no serial i/o interface is provided, the serial i/o (input/output) instructions are not available. mov dx, a is the only applicable derivative instruction because the derivative registers are write-only. rom space being restricted to 4 kbytes, sel mb2/3 would define non-existing program memory banks and should therefore be avoided. ram space being restricted to 224 bytes, care should be taken to avoid accesses to non-existing ram locations. 12 summary of mask options table 7 port mask options notes 1. port output drives: a) option 1: standard i/o. b) option 2: open-drain i/o. c) option 3: push-pull output; see pcd33xxa family data sheet. 2. port state after reset: s = set (high) and r = reset (low). table 8 mask options port name port output drive (1) port state after reset (2) option 1 option 2 option 3 set reset port 0 (p0.0 to p0.7) x x x x x port 1 (p1.0 to p1.7) x x x x x port 2 (p2.0 to p2.7) x x x x x feature description rom code: program/data any mix of instructions and data up to rom size of 4 kbytes. power-on-reset voltage level: v por 1.2 to 3.6 v in increments of 100 mv; off oscillator transconductance: g m low transconductance: g ml medium transconductance: g mm high transconductance: g mh
1998 may 11 10 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 13 limiting values in accordance with the absolute maximum rating system (iec 134); see note 1 and 2. notes 1. stresses above those listed under limiting values may cause permanent damage to the device. 2. parameters are valid over operating temperature range unless otherwise specified. all voltages are with respect to v ss unless otherwise noted. 14 handling inputs and outputs are protected against electrostatic discharge in normal handling. however, it is good practice to take normal precautions appropriate to handling mos devices (see handling mos devices ). 15 dc characteristics v dd = 1.8 to 6 v; v ss =0v; t amb = - 25 to +70 c; all voltages with respect to v ss ; f xtal = 3.58 mhz (g ml ); unless otherwise speci?ed. symbol parameter min. max. unit v dd supply voltage - 0.5 +7.0 v v i all input voltages - 0.5 v dd + 0.5 v i i, i o dc input or output current - 10 +10 ma p tot total power dissipation - 125 mw p o power dissipation per output - 30 mw i ss ground supply current - 50 +50 ma t stg storage temperature - 65 +150 c t j operating junction temperature - 90 c symbol parameter conditions min. typ. max. unit supply (see figs 5 to 9) v dd supply voltage operating; note 1 1.8 - 6v ram data retention in stop mode 1.0 - 6v i dd operating supply current; note 2 v dd = 3 v; value hgf 1 0 and/or lgf 1 0 - 0.9 1.8 ma v dd =3v - 0.3 0.6 ma v dd =5v; f xtal = 10 mhz (g ml ) - 1.1 3.0 ma v dd =5v; f xtal = 16 mhz (g mm ) - 1.7 5.0 ma v dd =5v; f xtal = 16 mhz (g mh ) - 2.5 6.0 ma i dd(idle) supply current idle mode; note 2 v dd = 3 v; value hgf 1 0 and/or lgf 1 0 - 0.7 1.4 ma v dd = 3 v; value hgf = lgf = 0 - 0.2 0.4 ma v dd =5v; f xtal = 10 mhz (g ml ) - 0.8 1.6 ma v dd =5v; f xtal = 16 mhz (g mm ) - 1.2 4.0 ma v dd =5v; f xtal = 16 mhz (g mh ) - 1.7 5.0 ma i dd(stp) supply current stop mode v dd = 1.8 v; t amb =25 c; note 3 - 1.0 2.5 m a v dd = 1.8 v; t amb =70 c; note 3 -- 10 m a
1998 may 11 11 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A notes 1. tone output requires v dd 3 2.5 v. 2. v il =v ss ; v ih =v dd ; open-drain outputs connected to v ss ; all other outputs open; value hgf = lgf = 0, unless otherwise specified. 3. crystal connected between xtal1 and xtal2; pins t1 and ce/ t0 at v ss ; value hgf = lgf = 0. 4. values are specified for dtmf frequencies only (cept). 5. related to the low group frequency (lgf) component (cept). 6. v por is an option chosen by the user. depending on its value, it may restrict the supply voltage range. inputs v il low-level input voltage 0 - 0.3v dd v v ih high-level input voltage 0.7v dd - v dd v i il input leakage current v ss v i v dd - 1 - +1 m a port outputs (see figs 10 to 12) i ol low-level port sink current v dd = 3 v; v o = 0.4 v 0.7 3.5 - ma i oh high-level port pull-up source current v o = 2.7 v; v dd =3v - 10 - 20 -m a v o =0v; v dd =3v -- 100 - 300 m a i oh high-level port push-pull source current v dd = 3 v; v o = 2.6 v - 0.7 - 4 - ma tone output (see fig.4; notes 1 and 4) v hgrms hgf voltage (rms) 158 181 205 mv v lgrms lgf voltage (rms) 125 142 160 mv frequency deviation - 0.6 - 0.6 % v dc dc voltage level - 0.5v dd - v ? z o ? output impedance - 100 500 w v g pre-emphasis of group 1.5 2.0 2.5 db thd total harmonic distortion t amb =25 c; note 5 - 25 - db power-on-reset d v por power-on-reset level variation around chosen v por note 6 - 0.5 0 +0.5 v symbol parameter conditions min. typ. max. unit f d f
1998 may 11 12 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A fig.4 tone output test circuit. handbook, halfpage mgb835 10 k w tone 50 pf 1 m f device type number (1) v dd v ss (1) device type number: PCD3349A fig.5 typical supply current (i dd ) in stop mode as a function of supply voltage (v dd ). handbook, halfpage 1 6 4 3 1 5 2 0 35 v dd (v) 7 mgb826 i dd(stp) ( m a) fig.6 typical operating supply current (i dd ) as a function of supply voltage (v dd ). h andbook, halfpage 1 6 4 2 0 35 v dd (v) 7 mgb827 i dd (ma) 16 mhz 3.58 mhz hgf or lgf 0 10 mhz 3.58 mhz measured with crystal between xtal1 and xtal2. fig.7 typical operating supply current (i dd ) as a function of clock frequency (f xtal ). handbook, halfpage 6 0 2 2 4 1 mgb828 10 10 i dd (ma) f xtal (mhz) 3 v 5 v measured with function generator on xtal1.
1998 may 11 13 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A fig.8 typical supply current (i dd ) in idle mode as a function of supply voltage (v dd ). h andbook, halfpage 1 6 4 2 0 35 v dd (v) 7 mgb829 i dd(idle) (ma) 16 mhz 3.58 mhz hgf or lgf 0 10 mhz 3.58 mhz measured with crystal between xtal1 and xtal2. fig.9 typical supply current (i dd ) in idle mode as a function of clock frequency (f xtal ). measured with function generator on xtal1. handbook, halfpage 6 0 2 2 4 1 mgb830 10 10 i dd(idle) (ma) f xtal (mhz) 3 v 5 v fig.10 typical low-level port output sink current (i ol ) as a function of supply voltage (v dd ). v o = 0.4 v. handbook, halfpage 1 12 8 4 0 35 v dd (v) 7 mgb831 i ol (ma) fig.11 typical high-level output pull-up source current (i oh ) as a function of supply voltage (v dd ). handbook, halfpage mbg095 v dd (v) 13 5 7 - 200 - 100 0 - 300 ( m a) i oh ss v = v o dd v = 0.9v o
1998 may 11 14 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A fig.12 typical high-level push-pull output source current (i oh ) as a function of supply voltage (v dd ). v o =v dd - 0.4 v. handbook, halfpage 1 - 12 - 8 - 4 0 35 v dd (v) 7 mgb833 i oh1 (ma) fig.13 typical power-on-reset level (v por ) as function of temperature. handbook, halfpage - 25 6 4 2 0 25 75 70 t amb ( c) 125 mgd495 v dd (v) v por = 1.3 v v por = 2.0 v
1998 may 11 15 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 16 ac characteristics v dd = 1.8 to 6 v; v ss =0v; t amb = - 25 to +70 c; all voltages with respect to v ss ; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit t r rise time all outputs v dd =5v; t amb =25 c; c l =50pf - 30 - ns t f fall time all outputs - 30 - ns f xtal clock frequency see fig.14 1 - 16 mhz oscillator (see fig.15) g ml low transconductance v dd = 5 v 0.2 0.4 1.0 ms g mm medium transconductance 0.9 1.6 3.2 ms g mh high transconductance 3.0 4.5 9.0 ms r f feedback resistor 0.3 1.0 3.0 m w handbook, halfpage mla493 v dd (v) 13 5 7 f xtal (mhz) 12 9 6 3 0 15 18 guaranteed operating range fig.14 maximum clock frequency (f xtal ) as a function of supply voltage (v dd ). fig.15 typical transconductance as a function of supply voltage (v dd ). handbook, halfpage 1357 v dd (v) 10 - 1 mbg097 1 10 g m (ms) g mh g mm g ml
1998 may 11 16 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 17 package outlines unit a max. 1 2 b 1 (1) (1) (1) cd e w em h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot117-1 92-11-17 95-01-14 a min. a max. b z max. m e e 1 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 3.9 3.4 0.25 2.54 15.24 15.80 15.24 17.15 15.90 1.7 5.1 0.51 4.0 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.15 0.13 0.01 0.10 0.60 0.62 0.60 0.68 0.63 0.067 0.20 0.020 0.16 051g05 mo-015ah m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 28 1 15 14 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. handbook, full pagewidth dip28: plastic dual in-line package; 28 leads (600 mil) sot117-1
1998 may 11 17 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot136-1 x 14 28 w m q a a 1 a 2 b p d h e l p q detail x e z c l v m a e 15 1 (a ) 3 a y 0.25 075e06 ms-013ae pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.71 0.69 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale so28: plastic small outline package; 28 leads; body width 7.5 mm sot136-1 95-01-24 97-05-22
1998 may 11 18 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 18 soldering 18.1 introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (order code 9398 652 90011). 18.2 dip 18.2.1 s oldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 18.2.2 r epairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. 18.3 so 18.3.1 r eflow soldering reflow soldering techniques are suitable for all so packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. 18.3.2 w ave soldering wave soldering techniques can be used for all so packages if the following conditions are observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow. the package footprint must incorporate solder thieves at the downstream end. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 18.3.3 r epairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1998 may 11 19 philips semiconductors product speci?cation 8-bit microcontroller with dtmf generator PCD3349A 19 definitions 20 life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
internet: http://www.semiconductors.philips.com philips semiconductors C a worldwide company ? philips electronics n.v. 1998 sca60 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 7430 johannesburg 2000, tel. +27 11 470 5911, fax. +27 11 470 5494 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2865, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. +90 212 279 2770, fax. +90 212 282 6707 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 181 730 5000, fax. +44 181 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 625 344, fax.+381 11 635 777 for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 34 waterloo road, north ryde, nsw 2113, tel. +61 2 9805 4455, fax. +61 2 9805 4466 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 160 1010, fax. +43 160 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 200 733, fax. +375 172 200 773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 689 211, fax. +359 2 689 102 canada: philips semiconductors/components, tel. +1 800 234 7381 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: prags boulevard 80, pb 1919, dk-2300 copenhagen s, tel. +45 32 88 2636, fax. +45 31 57 0044 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615800, fax. +358 9 61580920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 40 99 6161, fax. +33 1 40 99 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 23 53 60, fax. +49 40 23 536 300 greece: no. 15, 25th march street, gr 17778 tavros/athens, tel. +30 1 4894 339/239, fax. +30 1 4814 240 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, piazza iv novembre 3, 20124 milano, tel. +39 2 6752 2531, fax. +39 2 6752 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381 printed in the netherlands 415102/1200/05/pp20 date of release: 1998 may 11 document order number: 9397 750 03605


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